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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10796837 B1

PDFFull Text
Date of Patent:
Oct. 06, 2020

Filed:

Nov. 13, 2018

Electronic component, diaphragm, and electronic device

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Shingo Ito, Nagaokakyo, JP;

Naoki Gouchi, Nagaokakyo, JP;

Kosuke Takeuchi, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Mohamad A Musleh

Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 41/04 (2006.01); H04R 9/00 (2006.01); H01F 27/29 (2006.01); H05K 3/30 (2006.01); B06B 1/04 (2006.01); H05K 3/34 (2006.01); H04R 9/04 (2006.01); H01F 7/20 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H04R 7/00 (2006.01); H05K 1/18 (2006.01); H01F 7/06 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); B06B 1/04 (2013.01); H01F 7/20 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H04R 7/00 (2013.01); H04R 9/00 (2013.01); H04R 9/046 (2013.01); H05K 1/181 (2013.01); H05K 3/305 (2013.01); H05K 3/3436 (2013.01); H01F 2007/068 (2013.01); H01F 2017/004 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10992 (2013.01);
Abstract

An electronic component includes an insulating base material including insulating base material layers, a first main surface that is a mounting surface, a coil, mounting electrodes provided on the first main surface, and a projection. The coil includes coil conductors provided on the insulating base material layers and a winding axis in a laminating direction of the insulating base material layers. The projection is provided in an electrode non-forming portion of the first main surface, the electrode non-forming portion including no mounting electrodes therein, and provided along the coil conductors in planar view of the first main surface.

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