The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Jul. 13, 2016
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Michael F. Zybura, Scotts Valley, CA (US);

George Maxim, Saratoga, CA (US);

Dirk Robert Walter Leipold, San Jose, CA (US);

John August Orlowski, Summerfield, NC (US);

Baker Scott, San Jose, CA (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/30 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01L 23/48 (2013.01); H01L 23/49822 (2013.01); H01F 2017/0086 (2013.01); H05K 1/165 (2013.01); H05K 2201/10674 (2013.01);
Abstract

Embodiments of electronic devices, such as integrated circuit (IC) packages are disclosed. In one embodiment, an electronic device includes a first substrate and a second substrate. The first substrate has a first substrate body and a first inductor portion integrated into the first substrate body. Additionally, the second substrate comprises a second substrate body and a second inductor portion integrated into the second substrate body. The second substrate is mounted on the first substrate such that such that the second inductor portion is positioned over the first inductor portion and such that the second inductor portion is electrically connected to the first inductor portion so that the first inductor portion and the second inductor portion form a three dimensional (3D) inductor. By using two substrates, the 3D inductor can be increased in height while still allowing the substrates to be miniaturized and standardized for an IC package.


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