The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Feb. 07, 2018
Applicant:
Microsoft Technology Licensing, Llc, Redmond, WA (US);
Inventors:
Benjamin Patrick Sullivan, Redmond, WA (US);
James David Holbery, Bellevue, WA (US);
Siyuan Ma, Bothell, WA (US);
David Michael Lane, Sammamish, WA (US);
Thomas Joseph Longo, Redmond, WA (US);
Assignee:
Microsoft Technology Licensing, LLC, Redmond, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/02 (2006.01); H01H 13/83 (2006.01); H01H 13/7065 (2006.01); H05K 1/18 (2006.01); H01L 25/075 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); H01L 33/48 (2010.01); F21V 33/00 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0202 (2013.01); F21V 33/0052 (2013.01); H01H 13/7065 (2013.01); H01H 13/83 (2013.01); H01L 25/0753 (2013.01); H05K 1/181 (2013.01); H05K 3/1216 (2013.01); H01H 2219/039 (2013.01); H01H 2219/062 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/91 (2013.01); H01L 33/486 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/3015 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83856 (2013.01); H01L 2224/83862 (2013.01); H05K 1/0274 (2013.01); H05K 1/095 (2013.01); H05K 1/111 (2013.01); H05K 3/321 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01); H05K 2203/0278 (2013.01);
Abstract
User expectations demand that keypad layout and size, as well as keypad performance and illumination remain the same or improve over time. In various implementations, the keyboards disclosed and detailed herein incorporate an array of thermoset bare die light emitting diodes in an effort to more evenly distribute light through a keyboard structure without increasing keyboard thickness, as compared to prior art designs.