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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10795194 B1

PDFFull Text
Date of Patent:
Oct. 06, 2020

Filed:

May. 20, 2019

Method of manufacturing plate-shaped bonded body, bonding device, and plate-shaped bonded body

Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Kouichi Ogawa, Tochigi, JP;

Yoshihisa Shinya, Tochigi, JP;

Tomoyuki Toyoda, Tochigi, JP;

Yasumi Endo, Tokyo, JP;

Assignee:

DEXERIALS CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Philip C Tucker

Assistant Examiner:

Brian R Slawski

Int. Cl.
CPC ...
B32B 37/00 (2006.01); B32B 37/10 (2006.01); B32B 37/12 (2006.01); B32B 38/18 (2006.01); B32B 17/00 (2006.01); G02F 1/1333 (2006.01); B29C 65/00 (2006.01); B29C 65/48 (2006.01); B29C 65/52 (2006.01); B29C 65/54 (2006.01); B29C 43/28 (2006.01); B32B 7/12 (2006.01); B32B 17/06 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133308 (2013.01); B29C 43/28 (2013.01); B32B 7/12 (2013.01); B32B 17/00 (2013.01); B32B 17/064 (2013.01); B32B 37/003 (2013.01); B32B 37/0007 (2013.01); B32B 37/1284 (2013.01); B32B 38/1866 (2013.01); B29C 65/4845 (2013.01); B29C 65/524 (2013.01); B29C 65/542 (2013.01); B29C 66/342 (2013.01); B29C 66/345 (2013.01); B29C 66/73366 (2013.01); B32B 37/10 (2013.01); B32B 37/1292 (2013.01); B32B 2255/26 (2013.01); B32B 2307/412 (2013.01); B32B 2307/42 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/202 (2013.01); G02F 2001/133331 (2013.01); G02F 2202/28 (2013.01);
Abstract

A method for quickly applying and spreading adhesive between substrates without leaving air bubbles. The method includes holding two substrates apart from each other with adhesive sides facing, a second substrate being positioned above a first substrate. The second substrate is suspended in a manner so as to cause a portion to warp towards the first substrate. After a liquid filler is applied between the two substrates, rollers are lowered onto the second substrate and moved so as to disperse the liquid filler between the first and second substrates. In accordance with the rolling of the rollers, end portions of the second substrate are lowered towards the first substrate.

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