The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Sep. 30, 2019
Applicant:

Hewlett Packard Enterprise Development Lp, Houston, TX (US);

Inventors:

Mir Ashkan Seyedi, Palo Alto, CA (US);

Marco Fiorentino, Mountain View, CA (US);

Geza Kurczveil, Santa Barbara, CA (US);

Raymond G. Beausoleil, Seattle, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/43 (2006.01); H01S 3/13 (2006.01); G02B 6/42 (2006.01); H01S 3/23 (2006.01); H04B 10/50 (2013.01); H01S 3/131 (2006.01);
U.S. Cl.
CPC ...
G02B 6/43 (2013.01); G02B 6/4286 (2013.01); H01S 3/131 (2013.01); H01S 3/1305 (2013.01); H01S 3/2391 (2013.01);
Abstract

A photonic integrated circuit package includes two arrays or sets of integrated comb laser modules that are bonded to a silicon interposer. Each comb laser of an array has a common or overlapping spectral range, with each laser in the array being optically coupled to a local optical bus. The effective spectral range of the lasers in each array are different, or distinct, as to each array. An optical coupler is disposed within the silicon interposer and is optically coupled to each of the local optical buses. An ASIC (application specific integrated circuit) is bonded to the silicon interposer and provides control and operation of the comb laser modules.


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