The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Jun. 03, 2015
Applicant:

Acellent Technologies, Inc., Sunnyvale, CA (US);

Inventors:

Hung Chi Chung, San Jose, CA (US);

Mark Pappakostas, San Jose, CA (US);

Irene J. Li, Stanford, CA (US);

Assignee:

Acellent Technologies, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/04 (2006.01); G01N 29/48 (2006.01); G01N 29/265 (2006.01); G01N 29/22 (2006.01); G01N 29/24 (2006.01); G01N 29/34 (2006.01);
U.S. Cl.
CPC ...
G01N 29/043 (2013.01); G01N 29/223 (2013.01); G01N 29/48 (2013.01); G01N 29/2437 (2013.01); G01N 29/2462 (2013.01); G01N 29/265 (2013.01); G01N 29/343 (2013.01); G01N 2291/015 (2013.01); G01N 2291/0232 (2013.01); G01N 2291/0289 (2013.01); G01N 2291/044 (2013.01); G01N 2291/048 (2013.01); G01N 2291/105 (2013.01); G01N 2291/2634 (2013.01);
Abstract

A structural health monitoring apparatus is presented. According to an embodiment, the structural health monitoring apparatus comprises: a plurality of transducers configured for coupling to a structure, the structure comprising an outer structure surrounding and coupled to an inner structure, the transducers further configured for coupling to only the outer structure so as to transmit stress waves through the inner structure, and still further configured to receive the transmitted stress waves from the outer structure after they have passed through the inner structure; and an analyzer configured to detect damage within the inner structure according to the received transmitted stress waves from the outer structure.


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