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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10794784 B1

PDFFull Text
Date of Patent:
Oct. 06, 2020

Filed:

Dec. 04, 2017

Sensor module and method of making the same

Applicant:

Rohm Co., Ltd., Ukyo-ku, Kyoto, JP;

Inventors:

Yuto Nishiyama, Kyoto, JP;

Taro Nishioka, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Jamel E Williams

Int. Cl.
CPC ...
G01L 9/00 (2006.01); H05K 1/18 (2006.01); H05K 3/22 (2006.01); G01L 19/14 (2006.01); H05K 3/32 (2006.01); H01L 23/00 (2006.01); G01L 19/00 (2006.01); G01C 5/06 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0048 (2013.01); G01L 9/0054 (2013.01); G01L 19/0084 (2013.01); G01L 19/148 (2013.01); H01L 24/00 (2013.01); H05K 1/181 (2013.01); H05K 3/22 (2013.01); H05K 3/32 (2013.01); G01C 5/06 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4917 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/97 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/16152 (2013.01);
Abstract

The present invention provides a sensor module for preventing the corrosion of electrode pads and a method of manufacturing the same. The sensor module Aincludes: an electronic component, having a mounting surfaceand an installation surfacefacing opposite sides, wherein the mounting surfaceis disposed with electrode pads; an atmospheric pressure sensor, having a main surfaceand an installation surfacefacing opposite sides, and a side surfaceconnecting the main surfaceto the installation surface, and mounted on the mounting surfaceof the electronic componentwith the installation surfacefacing the electronic component; a bonding wire, connected to the electrode pads; and a protective member, covering the electrode pads. The protective memberexposes a portion of the bonding wireand is in contact with the side surfaceof the atmospheric pressure sensor

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