The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Sep. 04, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Charles G. Potter, Santa Clara, CA (US);

Eli Mor, Garden City, ID (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 27/26 (2006.01); G01B 7/14 (2006.01); H01J 37/32 (2006.01); G01B 7/00 (2006.01); G01B 7/06 (2006.01); G01B 7/02 (2006.01);
U.S. Cl.
CPC ...
G01B 7/14 (2013.01); G01B 7/003 (2013.01); G01B 7/023 (2013.01); G01B 7/08 (2013.01); G01B 7/087 (2013.01); H01J 37/32807 (2013.01); B65H 2220/03 (2013.01); B65H 2511/13 (2013.01); B65H 2511/162 (2013.01); B65H 2515/712 (2013.01); H01J 2237/2446 (2013.01); H01J 2237/24578 (2013.01);
Abstract

Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface and a second surface opposite the first surface. In an embodiment, the sensor wafer further comprises a first conductive pad with a first surface area, wherein the first conductive pad has a surface that is substantially coplanar with the first surface of the substrate. In an embodiment, the sensor wafer further comprises a second conductive pad with a second surface area that is smaller than the first surface area, wherein the second conductive pad has a surface that is substantially coplanar with the first surface of the substrate.


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