The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Jul. 18, 2017
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Akira Shimada, Otsu, JP;

Masao Tomikawa, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08G 73/10 (2006.01); H01L 21/3065 (2006.01); H01L 23/373 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/08 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08G 73/1067 (2013.01); H01L 21/3065 (2013.01); H01L 23/373 (2013.01); B32B 9/005 (2013.01); B32B 9/045 (2013.01); B32B 15/08 (2013.01);
Abstract

A resin composition including: (A) a polyimide resin containing 60 mol % or more of a diamine residue having a structure represented by General Formula (1) below in all diamine residues; (B) a thermosetting resin; and (C) a thermally conductive filler, wherein the resin composition contains 60 parts by volume or more of the thermally conductive filler (C) in 100 parts by volume of a total of the polyimide resin (A), the thermosetting resin (B), and the thermally conductive filler (C). Provided is a resin composition capable of providing a sheet that is excellent in heat resistance and thermal conductivity, has a low elastic modulus, and is excellent in thermal responsiveness.


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