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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10793717 B1

PDFFull Text
Date of Patent:
Oct. 06, 2020

Filed:

Jan. 20, 2016

Thermosetting resin composition, cured film, substrate with cured film, and electronic component

Applicant:

Jnc Corporation, Tokyo, JP;

Inventors:

Atsushi Murotani, Ichihara, JP;

Takayuki Hirota, Ichihara, JP;

Katsuyuki Sugihara, Ichihara, JP;

Yoshihiro Deyama, Ichihara, JP;

Shinta Morokoshi, Ichihara, JP;

Setsuo Itami, Ichihara, JP;

Toshiyuki Takahashi, Ichihara, JP;

Assignee:

JNC CORPORATION, Tokyo, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

David T Karst

Int. Cl.
CPC ...
C08L 77/12 (2006.01); C08L 63/00 (2006.01); C08G 73/10 (2006.01); C08G 73/16 (2006.01); C09D 179/08 (2006.01); C09D 7/61 (2018.01); C08G 59/24 (2006.01); C08G 59/42 (2006.01); C09D 163/00 (2006.01); C09D 177/12 (2006.01); C08K 3/22 (2006.01); C08K 5/1539 (2006.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
C08L 77/12 (2013.01); C08G 59/245 (2013.01); C08G 59/4223 (2013.01); C08G 73/1053 (2013.01); C08G 73/1064 (2013.01); C08G 73/1071 (2013.01); C08G 73/16 (2013.01); C08L 63/00 (2013.01); C09D 7/61 (2018.01); C09D 163/00 (2013.01); C09D 177/12 (2013.01); C09D 179/08 (2013.01); C08K 2003/2237 (2013.01);
Abstract

Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.

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Murotani, Atsushi. (2020). Thermosetting resin composition, cured film, substrate with cured film, and electronic component (U.S. Patent No. 10793717). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10793717

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