The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Feb. 15, 2017
Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Inventors:
Yoon Man Lee, Suwon-si, KR;
Jae Hyun Kim, Suwon-si, KR;
Tae Shin Eom, Suwon-si, KR;
Eun Jung Lee, Suwon-si, KR;
Su Mi Im, Suwon-si, KR;
Assignee:
SAMSUNG SDI CO., LTD., Yongin-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 3/12 (2006.01); C08L 63/00 (2006.01); C08K 3/36 (2006.01); H01L 23/29 (2006.01); H01L 33/56 (2010.01); C08J 3/20 (2006.01); C08G 59/02 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/02 (2013.01); C08J 3/12 (2013.01); C08J 3/20 (2013.01); C08K 3/36 (2013.01); H01L 23/295 (2013.01); H01L 33/56 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01);
Abstract
The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.