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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10793711 B1

PDFFull Text
Date of Patent:
Oct. 06, 2020

Filed:

Feb. 15, 2017

Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same

Applicant:

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Yoon Man Lee, Suwon-si, KR;

Jae Hyun Kim, Suwon-si, KR;

Tae Shin Eom, Suwon-si, KR;

Eun Jung Lee, Suwon-si, KR;

Su Mi Im, Suwon-si, KR;

Assignee:

SAMSUNG SDI CO., LTD., Yongin-si, Gyeonggi-do, KR;

Attorney:

Lee IP Law, P.C.

Primary Examiner:

David T Karst

Int. Cl.
CPC ...
C08J 3/12 (2006.01); C08L 63/00 (2006.01); C08K 3/36 (2006.01); H01L 23/29 (2006.01); H01L 33/56 (2010.01); C08J 3/20 (2006.01); C08G 59/02 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/02 (2013.01); C08J 3/12 (2013.01); C08J 3/20 (2013.01); C08K 3/36 (2013.01); H01L 23/295 (2013.01); H01L 33/56 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01);
Abstract

The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.

Find Patent Forward Citations

Lee, Yoon. (2020). Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same (U.S. Patent No. 10793711). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10793711

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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