The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Dec. 07, 2018
Applicant:

National Chung-shan Institute of Science and Technology, Taoyuan, TW;

Inventors:

Yi-Kang Lan, New Taipei, TW;

Shyh-Jang Sun, Taoyuan, TW;

Cheng-Huan Wang, Taipei, TW;

Jr-Jeng Ruan, Tainan, TW;

Yung-Chin Chien, Yunlin County, TW;

Kai-Chia Yeh, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 33/04 (2006.01); C08L 57/00 (2006.01); C08F 22/10 (2006.01); C08K 5/01 (2006.01); C08K 5/03 (2006.01); C08K 5/053 (2006.01); C08K 5/08 (2006.01); C08K 5/09 (2006.01); C08K 5/11 (2006.01); C08K 5/20 (2006.01); C08J 3/21 (2006.01); C08J 5/04 (2006.01); C08L 33/06 (2006.01); C08K 5/14 (2006.01); C08J 3/09 (2006.01); C08F 20/32 (2006.01); C08F 18/04 (2006.01); C08F 20/26 (2006.01); C08F 18/10 (2006.01); C08F 6/10 (2006.01); C08F 22/20 (2006.01);
U.S. Cl.
CPC ...
C08J 3/21 (2013.01); C08J 5/043 (2013.01); C08K 5/03 (2013.01); C08K 5/08 (2013.01); C08K 5/09 (2013.01); C08K 5/14 (2013.01); C08L 33/06 (2013.01); C08F 6/10 (2013.01); C08F 18/04 (2013.01); C08F 18/10 (2013.01); C08F 20/26 (2013.01); C08F 20/32 (2013.01); C08F 22/1006 (2020.02); C08F 22/20 (2013.01); C08J 3/095 (2013.01); C08J 2333/06 (2013.01); C08K 5/01 (2013.01); C08K 5/053 (2013.01); C08K 5/11 (2013.01); C08K 5/20 (2013.01); C08L 33/04 (2013.01); C08L 57/00 (2013.01); C08L 2666/30 (2013.01); C08L 2666/32 (2013.01); C08L 2666/34 (2013.01); C08L 2666/36 (2013.01); C08L 2666/66 (2013.01);
Abstract

A preparation method of vinyl ester resin for optimizing heat-release during curing includes: (A) providing a vinyl ester, a solvent and a phase change material to perform mixture; (B) performing a heating process to remove the solvent, so as to obtain a vinyl ester resin containing the phase change material. Thereby, the organic PCM material with high heat absorption and good resin affinity can be used as the temperature control agent of the vinyl ester resin during the curing process for avoiding the defects such as bubbles and cracks being generated in the vinyl ester resin.


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