The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Jan. 12, 2018
Applicant:
Worldvu Satellites Limited, Arlington, VA (US);
Inventors:
Alexander D. Smith, Algonquin, IL (US);
Daniel W. Field, San Diego, CA (US);
Armen Askijian, Sunnyvale, CA (US);
James Grossman, Belmont, CA (US);
Assignee:
WORLDVU SATELLITES LIMITED, Arlington, VA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B64G 1/50 (2006.01); F28D 15/04 (2006.01); F28F 1/16 (2006.01); F28D 15/02 (2006.01); F28D 20/02 (2006.01); F28F 1/42 (2006.01); B64G 1/10 (2006.01); B64G 1/26 (2006.01); B64G 1/28 (2006.01); B64G 1/40 (2006.01); B64G 1/66 (2006.01); F28D 20/00 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
B64G 1/50 (2013.01); B64G 1/503 (2013.01); B64G 1/506 (2013.01); F28D 15/0275 (2013.01); F28D 15/04 (2013.01); F28D 15/043 (2013.01); F28D 15/046 (2013.01); F28D 20/02 (2013.01); F28F 1/16 (2013.01); F28F 1/422 (2013.01); B64G 1/10 (2013.01); B64G 1/26 (2013.01); B64G 1/283 (2013.01); B64G 1/40 (2013.01); B64G 1/402 (2013.01); B64G 1/66 (2013.01); F28D 2020/0013 (2013.01); F28F 2013/006 (2013.01); Y02E 60/145 (2013.01);
Abstract
A passive thermal system for use in a satellite and other aerospace applications includes a container having a heat-pipe working fluid disposed in a first chamber and a Phase Change Material (PCM) disposed in a second chamber that substantially surrounds the first chamber. The first chamber contains a wick for transporting the heat-pipe working fluid. The exterior of the first chamber has fins, etc., that extend into the PCM for heat spreading and increased interface area.