The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Oct. 07, 2016
Applicant:
Magma Flooring Llc, River Falls, WI (US);
Inventor:
Jeffrey Jacob Cernohous, Hudson, WI (US);
Assignee:
Magma Flooring LLC, River Falls, WI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 39/16 (2006.01); B29B 13/06 (2006.01); B29C 70/02 (2006.01); C08K 3/40 (2006.01); C08K 7/02 (2006.01); C08K 7/22 (2006.01); B29K 101/12 (2006.01); B29K 105/16 (2006.01); B29L 31/10 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 39/16 (2013.01); B29B 13/06 (2013.01); B29C 70/025 (2013.01); C08K 3/40 (2013.01); B29K 2101/12 (2013.01); B29K 2105/16 (2013.01); B29L 2031/10 (2013.01); B29L 2031/30 (2013.01); B32B 2419/00 (2013.01); B32B 2605/00 (2013.01);
Abstract
A method of forming a substrate in a thermal compression bonding process that permit substantially greater amounts of fillers than previously accomplished. The method employs a dispersion of a thermoplastic binder and a filler. The dispersion is then thermally compression bonded to form a substrate. Lightweight fillers are one example of fillers that are ideally suited for the thermal compression bonding through the use of a dispersion. Such lightweight fillers enable the formation of a substrate with a very low and desirable specific gravity.