The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Jan. 26, 2015
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Saneyuki Goya, Tokyo, JP;

Masato Kinouchi, Tokyo, JP;

Atsushi Takita, Tokyo, JP;

Minoru Danno, Tokyo, JP;

Toshiya Watanabe, Tokyo, JP;

Takashi Ishide, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/0622 (2014.01); B23K 26/40 (2014.01); B23K 26/382 (2014.01); B23K 26/06 (2014.01); B23K 26/388 (2014.01); B23K 103/16 (2006.01); B23K 26/356 (2014.01); B23K 101/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0622 (2015.10); B23K 26/0613 (2013.01); B23K 26/356 (2015.10); B23K 26/388 (2013.01); B23K 26/389 (2015.10); B23K 26/40 (2013.01); B23K 2101/001 (2018.08); B23K 2103/172 (2018.08);
Abstract

Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.


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