The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2020
Filed:
Dec. 04, 2017
Applicant:
Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Inventors:
Kyung Hwan Jung, Yongin-si, KR;
Ju Hwan Kim, Yongin-si, KR;
Sang Kyo Shin, Yongin-si, KR;
Gye Hwan Lim, Yongin-si, KR;
Mun Sik Choi, Yongin-si, KR;
Assignee:
Samsung Display Co., Ltd., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 13/02 (2006.01); G02F 1/1345 (2006.01); H05B 6/44 (2006.01); G02F 1/13 (2006.01); H05B 6/14 (2006.01); B23K 13/01 (2006.01); G02F 1/1333 (2006.01); H05K 3/36 (2006.01); G02F 1/1368 (2006.01); H05K 1/14 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 13/02 (2013.01); B23K 13/01 (2013.01); G02F 1/1303 (2013.01); G02F 1/13458 (2013.01); H05B 6/14 (2013.01); H05B 6/44 (2013.01); B23K 2101/36 (2018.08); G02F 1/1368 (2013.01); G02F 1/13452 (2013.01); G02F 1/133305 (2013.01); H01L 2924/12044 (2013.01); H05K 1/144 (2013.01); H05K 3/361 (2013.01); H05K 2201/10136 (2013.01); H05K 2203/101 (2013.01);
Abstract
A bonding apparatus includes a support member configured to support a first substrate of a display panel and a connecting member, a bonding unit located above the support member and configured to compress the first substrate and the connecting member against each other using a bonding head to which a heating member is attached, and a magnetic-field generating part configured to generate a magnetic field to heat the heating member in an electromagnetic induction method.