The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Apr. 13, 2017
Applicants:

Fui Wen Lim, London, GB;

Andrew Guy Livingston, London, GB;

Andrew Timothy Boam, London, GB;

Inventors:

Fui Wen Lim, London, GB;

Andrew Guy Livingston, London, GB;

Andrew Timothy Boam, London, GB;

Assignee:

Evonik Degussa GmbH, Essen, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B01D 67/00 (2006.01); B01D 61/02 (2006.01); B01D 71/64 (2006.01); B01D 63/10 (2006.01);
U.S. Cl.
CPC ...
B01D 67/009 (2013.01); B01D 61/027 (2013.01); B01D 63/10 (2013.01); B01D 71/64 (2013.01); B01D 2313/04 (2013.01);
Abstract

The present invention relates to a method for curing adhesives used in the manufacture of membrane modules containing polymeric membranes, particularly polyimide based membranes used for the nanofiltration or ultrafiltration of solutes dissolved in organic solvents using microwaves. To maximise the chemical resistance of the adhesive used in these organic solvent applications, it must be as fully reacted and crosslinked ('cured') as possible. Typically, thermal processing (heating) of the entire membrane module is used to cure the adhesives. However, the time and temperature required to achieve this high degree of completion of reaction may damage the separation performance of the membrane contained within the membrane module. In one particular aspect, this process utilises microwaves to preferentially promote the curing of epoxy adhesives over the general heating of the membrane module.


Find Patent Forward Citations

Loading…