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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10790792 B1

PDFFull Text
Date of Patent:
Sep. 29, 2020

Filed:

Apr. 17, 2018

Lc composite device, processor, and method for manufacturing lc composite device

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Toshiyuki Nakaiso, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Jared Fureman

Assistant Examiner:

Lucy M Thomas

Int. Cl.
CPC ...
H01H 9/28 (2006.01); H03H 1/00 (2006.01); H01G 4/40 (2006.01); H01L 21/822 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 27/29 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 27/40 (2006.01); H02M 3/155 (2006.01); H03H 3/00 (2006.01); H02M 3/156 (2006.01); H02M 1/44 (2007.01); H03H 7/01 (2006.01);
U.S. Cl.
CPC ...
H03H 1/00 (2013.01); H01F 17/0013 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/40 (2013.01); H01F 41/042 (2013.01); H01F 41/046 (2013.01); H01G 4/40 (2013.01); H01L 21/822 (2013.01); H02M 3/155 (2013.01); H03H 3/00 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 3/4605 (2013.01); H01F 2017/0026 (2013.01); H01F 2027/2809 (2013.01); H02M 1/44 (2013.01); H02M 3/156 (2013.01); H03H 7/0115 (2013.01); H03H 2001/0057 (2013.01); H03H 2001/0085 (2013.01); H05K 2201/086 (2013.01);
Abstract

An LC composite device includes a capacitor portion, an inductor portion, and a magnetic body portion. The capacitor portion is configured of a first substrate and a thin film capacitance element formed on the first substrate through a thin film process. The inductor portion is configured of a second substrate and a thin film inductance element formed on the second substrate through a thin film process. The magnetic body portion includes a magnetic substrate, and the capacitor portion. The inductor portion and the magnetic body portion are stacked in a positional relationship in which the magnetic body portion and the inductor portion are in contact with each other.

Find Patent Forward Citations

Nakaiso, Toshiyuki. (2020). Lc composite device, processor, and method for manufacturing lc composite device (U.S. Patent No. 10790792). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10790792

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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