The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Aug. 06, 2018
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventors:
Michael Joseph McPartlin, North Andover, MA (US);
Bharatjeet Singh Gill, Ottawa, CA;
Stephen Joseph Kovacic, Ottawa, CA;
Assignee:
Skyworks Solutions, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/30 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H03F 3/195 (2006.01); H03F 3/24 (2006.01); H04B 1/44 (2006.01); H03F 3/21 (2006.01); H01L 29/732 (2006.01); H01L 23/36 (2006.01); H01L 29/161 (2006.01); H01L 21/8222 (2006.01); H01L 23/528 (2006.01); H01L 23/66 (2006.01); H01L 27/06 (2006.01); H01L 49/02 (2006.01); H03F 1/56 (2006.01); H03F 3/213 (2006.01); H04B 1/04 (2006.01); H04B 1/48 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 29/10 (2006.01); H01L 29/16 (2006.01); H01L 29/417 (2006.01); H04W 88/02 (2009.01);
U.S. Cl.
CPC ...
H03F 1/302 (2013.01); H01L 21/4853 (2013.01); H01L 21/4882 (2013.01); H01L 21/8222 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/3157 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/3738 (2013.01); H01L 23/49816 (2013.01); H01L 23/49844 (2013.01); H01L 23/528 (2013.01); H01L 23/5223 (2013.01); H01L 23/5286 (2013.01); H01L 23/53214 (2013.01); H01L 23/53228 (2013.01); H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 25/50 (2013.01); H01L 27/0647 (2013.01); H01L 27/0658 (2013.01); H01L 28/20 (2013.01); H01L 28/40 (2013.01); H01L 29/1004 (2013.01); H01L 29/16 (2013.01); H01L 29/161 (2013.01); H01L 29/41708 (2013.01); H01L 29/732 (2013.01); H01L 29/7325 (2013.01); H03F 1/56 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H03F 3/213 (2013.01); H03F 3/24 (2013.01); H03F 3/245 (2013.01); H04B 1/0475 (2013.01); H04B 1/44 (2013.01); H04B 1/48 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1302 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81447 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/1305 (2013.01); H03F 2200/387 (2013.01); H03F 2200/447 (2013.01); H03F 2200/451 (2013.01); H04B 2001/0408 (2013.01); H04W 88/02 (2013.01);
Abstract
Solder bumps are placed in direct contact with the silicon substrate of an amplifier integrated circuit having a flip chip configuration. A plurality of amplifier transistor arrays generate waste heat that promotes thermal run away of the amplifier if not directed out of the integrated circuit. The waste heat flows through the thermally conductive silicon substrate and out the solder bump to a heat-sinking plane of an interposer connected to the amplifier integrated circuit via the solder bumps.