The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Mar. 05, 2019
Applicant:

Sharp Kabushiki Kaisha, Sakai, Osaka, JP;

Inventor:

Eiji Suematsu, Sakai, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 13/08 (2006.01); H01Q 21/06 (2006.01); H01Q 1/22 (2006.01); H01Q 21/24 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0407 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 13/08 (2013.01); H01Q 21/061 (2013.01); H01Q 21/065 (2013.01); H01Q 21/24 (2013.01); H01L 2223/6627 (2013.01);
Abstract

A microwave device includes a board having a first face and a second face, a transmitting antenna portion provided on the first face, a receiving antenna portion provided on the first face, and a high-frequency circuit portion that is provided on the first face and is connected to the transmitting antenna portion and the receiving antenna portion. The microwave device further includes, on the second face of the board, a ground face that is provided shared by the transmitting antenna portion, receiving antenna portion, and high-frequency circuit portion, and a via hole connecting another ground face of the high-frequency circuit portion and the ground face. A ground face shared by the transmitting antenna portion, receiving antenna portion, and high-frequency circuit portion is configured by the ground faces and the via hole.


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