The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Dec. 14, 2016
Applicant:
Commscope Technologies Llc, Hickory, NC (US);
Inventor:
Charles J. Buondelmonte, Baldwinsville, NY (US);
Assignee:
CommScope Technologies LLC, Hickory, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 7/00 (2006.01); H01Q 1/24 (2006.01); H01Q 15/14 (2006.01); H01Q 21/00 (2006.01); H01Q 21/08 (2006.01); H01Q 21/28 (2006.01); H01Q 3/26 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/246 (2013.01); H01Q 15/14 (2013.01); H01Q 21/0075 (2013.01); H01Q 21/08 (2013.01); H01Q 21/28 (2013.01); H01Q 3/26 (2013.01);
Abstract
Aspects of the present disclosure may be directed to a multi-layer feed-board with all the functional components, including phase shifters, diplexers, and dipole element, employed thereon. Therefore, solder interfaces at cable to functional component interfaces are no longer necessary. Instead, component interfaces are within the confines of the multi-layer feed-board, thereby reducing PIM issues attributed to solder joint interfaces.