The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Mar. 15, 2017
Applicant:

Finisar Corporation, Sunnyvale, CA (US);

Inventors:

Andrei Kaikkonen, Jaerfaella, SE;

Robert Monroe Smith, Phoenix, AZ (US);

Lennart Per Olof Lundqvist, Jaerfaella, SE;

Lars-Goete Svenson, Sollentuna, SE;

Marek Grzegorz Chacinski, Farsta, SE;

Assignee:

II-VI Delaware Inc., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01P 3/08 (2006.01); H01P 3/00 (2006.01); H01P 3/02 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01P 7/08 (2006.01); H01L 31/105 (2006.01);
U.S. Cl.
CPC ...
H01P 3/081 (2013.01); H01P 3/006 (2013.01); H01P 3/026 (2013.01); H05K 1/0243 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H01L 31/105 (2013.01); H01P 7/08 (2013.01); H05K 1/0225 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10174 (2013.01);
Abstract

A carrier layout comprising a substrate comprising a ground plane layer and a coplanar waveguide interconnect disposed onto the substrate. The coplanar waveguide interconnect comprises a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The coplanar conductors of the pair are electrically connected to each other by at least one conducting island that is isolated from the ground plane layer. The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate having a ground plane layer, the interconnect structure comprising a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The conductors of the pair are electrically connected by at least one conducting island that is isolated from the ground plane layer.


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