The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Aug. 16, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Fei Gao, Shenzhen, CN;

Guangxin Zhao, Shenzhen, CN;

Jianwang Wu, Shenzhen, CN;

Jinpei Ju, Shenzhen, CN;

Lei Cai, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/205 (2006.01); H01P 1/208 (2006.01); H01P 7/06 (2006.01); H01P 11/00 (2006.01); H01P 1/207 (2006.01);
U.S. Cl.
CPC ...
H01P 1/2053 (2013.01); H01P 1/205 (2013.01); H01P 1/207 (2013.01); H01P 1/208 (2013.01); H01P 7/06 (2013.01); H01P 11/008 (2013.01);
Abstract

Provided is a cavity filter that is one of radio frequency filters. The cavity filter includes a printed circuit board (PCB) substrate including a micro band layer, metal layers for grounding, which are arranged on both surfaces of the PCB substrate, having the micro band layer interposed therebetween, a plurality of standard cavity modules which are arranged on the both surfaces of the PCB substrate, in each of which an open side surface is fixed and sealed onto the metal layer, and a plurality of coupling windows, in each of which a part of the metal layer for grounding is removed to expose a part of the PCB substrate.


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