The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Jul. 27, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Salvatore Bernardo Olivadese, Stamford, CT (US);

James Robert Rozen, Peekskill, NY (US);

Patryk Gumann, Tarrytown, NY (US);

Martin O. Sandberg, Ossining, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/24 (2006.01); H01L 39/02 (2006.01); H01L 39/24 (2006.01); H01P 3/00 (2006.01); H01P 3/08 (2006.01); H01P 11/00 (2006.01); H03H 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 39/02 (2013.01); H01L 39/24 (2013.01); H01P 3/003 (2013.01); H01P 3/08 (2013.01); H01P 3/081 (2013.01); H01P 11/003 (2013.01); H03H 3/00 (2013.01); H03H 7/24 (2013.01);
Abstract

Techniques for implementing multiple microwave attenuators on a high thermal conductivity substrate for cryogenic applications to reduce heat and thermal noise during quantum computing are provided. In one embodiment, a device for using in cryogenic environment is provided that comprises a substrate having a thermal conductivity above a defined threshold, a plurality of transmission lines fabricated on the substrate and arranged with a separation gap between the plurality of transmission lines to maintain crosstalk below −50 decibels, and one or more microwave attenuators embedded on the plurality of transmission lines.


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