The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Dec. 26, 2018
Applicant:

Jiaxing Super Lighting Electric Appliance Co., Ltd, Jiaxing, CN;

Inventors:

Tao Jiang, Jiaxing, CN;

Weihong Xu, Jiaxing, CN;

Yukihiro Saito, Jiaxing, CN;

Hayato Unagike, Jiaxing, CN;

Aiming Xiong, Jiaxing, CN;

Junfeng Xu, Jiaxing, CN;

Yiching Chen, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); F21K 9/237 (2016.01);
U.S. Cl.
CPC ...
H01L 33/508 (2013.01); F21K 9/237 (2016.08); H01L 25/0753 (2013.01); H01L 33/501 (2013.01); H01L 33/62 (2013.01);
Abstract

An LED filament comprises at least one LED section, a conductive section, two conductive electrodes and a light conversion layer. The conductive section is used to electrically connect two adjacent LED sections. The two conductive electrodes are electrically connected to each of the LED sections. Each of the LED sections includes at least two LED chips electrically connected to each other. The light conversion layer covers the LED sections, the conductive sections and the conductive electrodes, and a part of the two electrodes is exposed respectively. Since the LED filament includes the LED section and the conductive section, when the LED filament is bent, the stress is easily concentrated on the conductive section. Therefore, the breakage probability of the conductive wires connected within the LED section is reduced during bending. The quality of the LED filament and its application is improved.


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