The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Aug. 06, 2014
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
Xiaogang Bai, South Pasadena, CA (US);
Rengarajan Sudharsanan, Stevenson Ranch, CA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 31/18 (2006.01); H01L 27/146 (2006.01); H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 31/1876 (2013.01); H01L 27/1469 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 31/02327 (2013.01);
Abstract
A method and apparatus for fabricating sensor chip assemblies. A photodetector wafer and an optics wafer are bonded to each other. Photodetectors are formed on the photodetector wafer. A circuit wafer is bonded to the photodetector wafer that is bonded to the optics wafer after forming the photodetectors on the photodetector wafer.