The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Sep. 05, 2018
Applicant:
Mediatek Inc., Hsinchu, TW;
Inventors:
Cheng-Tien Wan, Hsinchu, TW;
Yao-Tsung Huang, Hsinchu, TW;
Yun-San Huang, Hsinchu, TW;
Ming-Cheng Lee, Zhubei, TW;
Wei-Che Huang, Hsinchu County, TW;
Assignee:
MEDIATEK INC., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 21/8238 (2006.01); H01L 29/417 (2006.01); H01L 27/088 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66795 (2013.01); H01L 21/823431 (2013.01); H01L 21/823821 (2013.01); H01L 21/845 (2013.01); H01L 27/0886 (2013.01); H01L 27/1211 (2013.01); H01L 29/41791 (2013.01); H01L 29/66818 (2013.01); H01L 29/785 (2013.01); H01L 29/7851 (2013.01);
Abstract
A semiconductor chip includes a substrate and a transistor. The transistor is formed on the substrate and includes an insulation layer and a fin. The fin includes a base portion and a protrusion connected with the base portion, wherein the protrusion is projected with respect to an upper surface of the base portion and has a recess recessed with respect to the upper surface.