The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Jul. 27, 2018
Applicant:

Lumens Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Taekyung Yoo, Yongin-si, KR;

Seunghyun Oh, Yongin-si, KR;

Sungsik Jo, Yongin-si, KR;

Minpyo Kim, Yongin-si, KR;

Jiyu Shin, Yongin-si, KR;

Daewon Kim, Yongin-si, KR;

Assignee:

LUMENS CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 25/16 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/0093 (2020.05); H01L 33/62 (2013.01);
Abstract

A light emitting element is disclosed. The light emitting element includes: a mount substrate on which a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad are disposed; a first vertical LED chip mounted on the mount substrate such that the bottom portion of the first vertical LED chip is connected to the first electrode pad; a second vertical LED chip mounted on the mount substrate such that the bottom portion of the second vertical LED chip is connected to the second electrode pad; a third vertical LED chip mounted on the mount substrate such that the bottom portion of the third vertical LED chip is connected to the third electrode pad; a light-transmitting conductive plate electrically connected to the top portions of the first vertical LED chip, the second vertical LED chip, and the third vertical LED chip; and a conductor connecting the light-transmitting conductive plate to the fourth electrode pad. Individual driving powers are applied to the first vertical LED chip, the second vertical LED chip, and the third vertical LED chip through the first electrode pad, the second electrode pad, and the third electrode pad, respectively, or through the fourth electrode pad.


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