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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10790219 B1

PDFFull Text
Date of Patent:
Sep. 29, 2020

Filed:

May. 20, 2019

Semiconductor package and method of manufacturing the same

Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Inventors:

Yoshihisa Imori, Yokohama Kanagawa, JP;

Kenji Yamada, Yokohama Kanagawa, JP;

Assignee:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Attorney:

White & Case LLP

Primary Examiner:

Thien F Tran

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 21/4842 (2013.01); H01L 21/561 (2013.01); H01L 23/3107 (2013.01); H01L 23/49537 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 24/49 (2013.01); H01L 24/97 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01);
Abstract

According to one embodiment, a semiconductor package includes a die pad, a semiconductor chip, a lead frame, and an insulating part. The semiconductor chip is provided on the die pad. The lead frame is separated from the die pad. The lead frame is electrically connected to a terminal of the semiconductor chip. The lead frame includes a first part and a second part disposed between the first part and the die pad. An upper surface of the first part is located below an upper surface of the second part. The insulating part is provided on the die pad, the semiconductor chip, and the second part. The insulating part seals the semiconductor chip.

Find Patent Forward Citations

Imori, Yoshihisa. (2020). Semiconductor package and method of manufacturing the same (U.S. Patent No. 10790219). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10790219

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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