The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Oct. 02, 2019
Applicant:

Cooler Master Technology Inc., New Taipei, TW;

Inventors:

Yu-Te Wei, New Taipei, TW;

Di Han Wu, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H05K 7/20 (2006.01); H01L 23/427 (2006.01); F28D 1/02 (2006.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); F28D 1/0233 (2013.01); F28D 15/0275 (2013.01); H01L 23/427 (2013.01); H01L 2023/4068 (2013.01); H01L 2023/4087 (2013.01);
Abstract

This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source of a circuit board and including a main body part and an engagement assembly. The main body part includes a thermally conductive component and at least one fin assembly. The thermally conductive component is configured to be in thermal contact with the heat source, and the at least one fin assembly is thermally coupled to the thermally conductive component. The engagement assembly includes at least one first cover and at least one fastener. The at least one first cover presses against a side of the at least one fin assembly that is located away from the heat source. The at least one fastener is disposed through the at least one first cover and the at least one fin assembly and is configured to be fixed to the circuit board.


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