The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Aug. 17, 2018
Applicants:

Lim Lai Ming, Penang, MY;

Zambri Bin Samsudin, Penang, MY;

Inventors:

Lim Lai Ming, Penang, MY;

Zambri Bin Samsudin, Penang, MY;

Assignee:

JABIL INC., St. Petersburg, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/67 (2006.01); C23C 18/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67138 (2013.01); C23C 18/08 (2013.01); H01L 21/485 (2013.01);
Abstract

The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.


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