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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10790163 B1

PDFFull Text
Date of Patent:
Sep. 29, 2020

Filed:

Jan. 17, 2019

Semiconductor sensor and method for manufacturing the same

Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventor:

Masaaki Tanaka, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

Seahvosh Nikmanesh

Int. Cl.
CPC ...
H01L 21/56 (2006.01); B29C 45/14 (2006.01); B29C 45/26 (2006.01); B29C 45/17 (2006.01); H01L 23/495 (2006.01); B29C 45/00 (2006.01); B29L 31/34 (2006.01); B29L 31/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); B29C 45/14065 (2013.01); B29C 45/14655 (2013.01); B29C 45/17 (2013.01); B29C 45/26 (2013.01); H01L 21/56 (2013.01); H01L 23/49541 (2013.01); B29C 45/0046 (2013.01); B29L 2031/34 (2013.01); B29L 2031/752 (2013.01); H01L 23/3107 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract

In a method for manufacturing a semiconductor sensor, an upper mold has a pair of projections on a wall surface opposing to side surfaces of a semiconductor chip in a first cavity and at positions closest to a second cavity. The projections project so as to reduce the space between the side surfaces of the semiconductor chip and the upper mold, so that a flow of a resin material from a first cavity to a second cavity is delayed. The resin material is filled in the first cavity prior to the second cavity. After a portion of a film corresponding to the first cavity is entirely brought into close contact with the upper mold, the resin material is filled in the second cavity.

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