The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Jan. 15, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Byoung Jin Chun, Suwon-si, KR;

Hye Jin Jeong, Suwon-si, KR;

Chung Yeol Lee, Suwon-si, KR;

Sang Moon Lee, Suwon-si, KR;

Hye Young Choi, Suwon-si, KR;

Myung Jun Park, Suwon-si, KR;

Young Sook Lee, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 4/12 (2013.01);
Abstract

A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.


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