The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Oct. 03, 2019
Applicant:
Hexcel Corporation, Dublin, CA (US);
Inventors:
Kathlyn Lizette Baron, Dublin, CA (US);
Gordon Emmerson, Dublin, CA (US);
Yen-Seine Wang, San Ramon, CA (US);
Assignee:
HEXCEL CORPORATION, Dublin, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F02K 9/34 (2006.01); B29C 70/50 (2006.01); B29B 15/12 (2006.01); C08L 63/04 (2006.01); C08L 77/06 (2006.01); C08L 79/08 (2006.01);
U.S. Cl.
CPC ...
F02K 9/34 (2013.01); B29B 15/122 (2013.01); B29C 70/50 (2013.01); C08L 63/04 (2013.01); C08L 77/06 (2013.01); C08L 79/08 (2013.01);
Abstract
A semipreg that can be cured/molded to form aerospace composite parts including rocket booster casings. The semipreg includes a fibrous layer and a resin layer located on one side of the fibrous layer. The resin layer includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.