The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Sep. 10, 2018
Applicant:
Kcf Technologies Co., Ltd., Anyang-si, Gyeonggi-do, KR;
Inventors:
Seung Min Kim, Anyang-si, KR;
Jeong Gil Lee, Anyang-si, KR;
Assignee:
KCF TECHNOLOGIES CO., LTD., Anyang-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 5/48 (2006.01); C25D 5/16 (2006.01); H05K 1/03 (2006.01); H05K 3/42 (2006.01); C25D 7/06 (2006.01); H05K 3/02 (2006.01); H05K 3/28 (2006.01); C25D 1/04 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C25D 1/04 (2013.01); C25D 5/16 (2013.01); C25D 5/48 (2013.01); C25D 7/0614 (2013.01); H05K 1/0393 (2013.01); H05K 3/025 (2013.01); H05K 3/282 (2013.01); H05K 3/423 (2013.01); H05K 2201/0335 (2013.01); H05K 2203/0723 (2013.01);
Abstract
Disclosed is a copper foil including a copper layer and having a tensile strength of 29 to 65 kgf/mm, a mean width of roughness profile elements (Rsm) of 18 to 148 μm and a texture coefficient bias [TCB(220)] of 0.52 or less.
Kim, Seung. (2020). Copper foil with minimized bagginess, wrinkle or tear, electrode including the same, secondary battery including the same and method for manufacturing the same (U.S. Patent No. 10787752). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10787752
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile