The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Mar. 25, 2016
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, Tokyo, JP;

Inventor:
Assignee:

MITSUBISHI ELECTRIC CORPORATION, Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B61C 17/12 (2006.01); H01L 23/34 (2006.01); B61C 17/00 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
B61C 17/12 (2013.01); B61C 17/00 (2013.01); H01L 23/34 (2013.01); B60L 2200/26 (2013.01); H01L 23/40 (2013.01); H05K 7/14 (2013.01); H05K 7/209 (2013.01); H05K 7/20854 (2013.01);
Abstract

An open part that has an opening surface that is perpendicular to the horizontal direction is formed in a housing of a vehicle control device. An interior of the housing is divided into a first space including the open part and a second space by a partitioning member, a main surface thereof having a hole formed therein and opposing the opening surface. The semiconductor cooling unit is housed in the first space. The semiconductor cooling unit is detachably attached in a direction in which the opening surface and the partitioning member oppose each other. An engaging member arranged on the cover of the semiconductor cooling unit engages a guide arranged on the housing, and the guide supports weight of the semiconductor cooling unit. A heat sink is provided on a base plate and forms a vertically-directed flow passage.


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