The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Sep. 10, 2018
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Lee E. Hooton, Ridge, NY (US);

Marwan Rammah, San Francisco, CA (US);

James A. Bertin, San Jose, CA (US);

Stoyan P. Hristov, San Jose, CA (US);

William A. Counts, Sunnyvale, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); F28F 21/08 (2006.01); B41M 5/24 (2006.01); G06F 1/16 (2006.01); H04M 1/02 (2006.01); H01P 3/08 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 5/03 (2006.01); H05K 5/06 (2006.01); H05K 9/00 (2006.01); H01R 12/79 (2011.01); H05K 1/14 (2006.01); H02J 50/10 (2016.01); H02J 7/02 (2016.01);
U.S. Cl.
CPC ...
B41M 5/24 (2013.01); F28F 21/084 (2013.01); F28F 21/085 (2013.01); G06F 1/1626 (2013.01); G06F 1/1656 (2013.01); H01P 3/08 (2013.01); H04M 1/0202 (2013.01); H05K 1/0216 (2013.01); H05K 1/181 (2013.01); H05K 5/0004 (2013.01); H05K 5/0017 (2013.01); H05K 5/0086 (2013.01); H05K 5/0217 (2013.01); H05K 5/03 (2013.01); H05K 5/069 (2013.01); H05K 7/2039 (2013.01); H05K 9/0007 (2013.01); H05K 9/0075 (2013.01); H01R 12/79 (2013.01); H02J 7/025 (2013.01); H02J 50/10 (2016.02); H04M 1/026 (2013.01); H04M 1/0264 (2013.01); H04M 1/0283 (2013.01); H05K 1/147 (2013.01); H05K 2201/10189 (2013.01);
Abstract

This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.


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