The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Apr. 25, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Teppei Kojio, Yamanashi, JP;

Koji Motomura, Osaka, JP;

Hiroki Maruo, Hyogo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 23/48 (2006.01); B23K 35/36 (2006.01); H01L 23/00 (2006.01); B23K 35/365 (2006.01); B23K 35/362 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3612 (2013.01); B23K 35/362 (2013.01); B23K 35/365 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 23/3121 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/759 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75343 (2013.01); H01L 2224/75349 (2013.01); H01L 2224/75353 (2013.01); H01L 2224/75701 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/75822 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/81002 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/81022 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81055 (2013.01); H01L 2224/81085 (2013.01); H01L 2224/81132 (2013.01); H01L 2224/81149 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81207 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81912 (2013.01); H01L 2224/81914 (2013.01); H01L 2924/12041 (2013.01);
Abstract

The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.


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