The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Jul. 11, 2018
Applicant:

Asia Vital Components Co., Ltd., New Taipei, TW;

Inventor:

Hsiu-Wei Yang, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H04B 1/036 (2006.01); H04B 1/3888 (2015.01); G06F 1/20 (2006.01); H04M 1/02 (2006.01); F28F 21/04 (2006.01); F28F 21/08 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); G06F 1/203 (2013.01); H04B 1/036 (2013.01); H04B 1/3888 (2013.01); H04M 1/0202 (2013.01); F28D 2021/0029 (2013.01); F28F 21/04 (2013.01); F28F 21/083 (2013.01); F28F 21/086 (2013.01); G06F 1/20 (2013.01); G06F 2200/1633 (2013.01); H04M 1/026 (2013.01);
Abstract

A case heat dissipation unit of handheld electronic device includes a back cover including a ceramic layer. A titanium metal layer or a stainless steel metal layer is disposed on the ceramic layer in a position corresponding to at least one heat source. The ceramic layer is an outer surface of the handheld electronic device and exposed to an external environment. The titanium metal layer or the stainless steel metal layer faces a receiving space of the handheld electronic device in contact with the heat source in the receiving space. The titanium metal layer or the stainless steel metal layer serves to absorb the heat generated by the heat source and transfer the heat to the ceramic layer for dissipating the heat.


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