The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
May. 06, 2019
Applicant:
Htc Corporation, Taoyuan, TW;
Inventors:
Chih-Yao Kuo, Taoyuan, TW;
Chin-Kai Sun, Taoyuan, TW;
Chun-Lung Chu, Taoyuan, TW;
Wei-Cheng Liu, Taoyuan, TW;
Assignee:
HTC Corporation, Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 7/14 (2006.01); H05K 1/18 (2006.01); H05K 5/03 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20381 (2013.01); H05K 1/181 (2013.01); H05K 5/03 (2013.01); H05K 7/1427 (2013.01); H05K 7/20327 (2013.01); H05K 7/20336 (2013.01);
Abstract
A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member, and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a fourth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.