The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
May. 07, 2019
Hong Fu Jin Precision Industry (Wuhan) Co., Ltd., Wuhan, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Hou-Yuan Chou, New Taipei, TW;
Yi-Chih Wu, New Taipei, TW;
HONG FU JIN PRECISION INDUSTRY (WuHan) CO., I, Wuhan, CN;
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Abstract
A circuit board optimized for a denser component population within a standard size of footprint includes a mother board and a plurality of sub-board layers stacked on and connected to the mother board. Each of the sub-board layers has a plurality of daughter boards. The sub-board layers are composed of a first sub-board layer and a second sub-board layer. The daughter boards of the first sub-board layer are arranged on a side of the mother board, and the daughter boards of the second sub-board layer are arranged on the daughter boards of the first sub-board layer.