The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Sep. 21, 2017
Applicant:
Amazon Technologies, Inc., Seattle, WA (US);
Inventor:
William Mische, Seattle, WA (US);
Assignee:
Amazon Technologies, Inc., Seattle, WA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); B33Y 80/00 (2015.01); F28F 3/02 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/021 (2013.01); B33Y 80/00 (2014.12); H05K 1/0204 (2013.01); H05K 1/181 (2013.01); H05K 3/0044 (2013.01); H05K 3/4697 (2013.01); F28F 3/022 (2013.01); F28F 2275/14 (2013.01); H05K 3/005 (2013.01); H05K 3/10 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/1059 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10386 (2013.01); H05K 2201/10416 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/063 (2013.01); H05K 2203/166 (2013.01);
Abstract
Printed circuit boards (PCBs) may include a heat sink configured to draw heat from a surface-mounted component through the PCB toward a side of the PCB opposite a side having the surface-mounted component. The heat sinks may be single piece components that extend at least partially through the PCB. In some embodiments, the PCB may include connectors that interface between the PCB and a heat sink, or possibly other components.