The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Apr. 09, 2018
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
Susan C. Trulli, Lexington, MA (US);
Christopher M. Laighton, Boxborough, MA (US);
Assignee:
Raytheon Company, Waltham, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/66 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H05K 3/12 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H03F 3/195 (2006.01); H03F 3/21 (2006.01); H03F 3/213 (2006.01); H01L 25/16 (2006.01); H01L 21/56 (2006.01); H05K 3/34 (2006.01); H01L 25/18 (2006.01); H03F 1/30 (2006.01); H01L 23/373 (2006.01); H01P 3/08 (2006.01); H01P 11/00 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H01L 21/4846 (2013.01); H01L 21/4882 (2013.01); H01L 21/56 (2013.01); H01L 23/367 (2013.01); H01L 23/3675 (2013.01); H01L 23/373 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01L 25/165 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H03F 1/301 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H03F 3/213 (2013.01); H05K 1/0243 (2013.01); H05K 1/0271 (2013.01); H05K 1/181 (2013.01); H05K 3/1283 (2013.01); H05K 3/34 (2013.01); H01L 23/3736 (2013.01); H01L 23/42 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6683 (2013.01); H01P 3/081 (2013.01); H01P 11/003 (2013.01); H03F 2200/255 (2013.01); H03F 2200/33 (2013.01); H03F 2200/423 (2013.01); H05K 2201/066 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10378 (2013.01);
Abstract
A MMIC support and cooling structure having a three-dimensional, thermally conductive support structure having a plurality of surfaces and a circuit having a plurality of heat generating electrical components disposed on a first portion of the surfaces and interconnected by microwave transmission lines disposed on a second portion of the plurality of surfaces of the thermally conductive support structure.