The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Jun. 14, 2019
Applicant:

Db Hitek Co., Ltd., Seoul, KR;

Inventors:

Ye Eun Na, Seoul, KR;

Han Choon Lee, Seoul, KR;

Assignee:

DB HITEK CO., LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 31/00 (2006.01); H04R 7/04 (2006.01); H04R 7/18 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); H04R 7/04 (2013.01); H04R 7/18 (2013.01); H04R 31/003 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate, a diaphragm disposed between the substrate and the back plate, a first supporting member surrounding the diaphragm, the first supporting member including first dam portions arranged along a circumference of the diaphragm, and first slit portions between the first dam portion adjacent to each other to be configured to support the diaphragm from a lower face of the substrate, and a second supporting member surrounding the first supporting member, the second supporting member including second dam portions arranged along a circumference of the first dam portions, and second slit portions between the second dam portion adjacent to each other to be configured to further support the diaphragm from the lower face of the substrate. Thus, the MEMS microphone has an increased acoustic resistance.


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