The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Apr. 30, 2019
Applicant:
Sae Magnetics (H.k.) Ltd., Hong Kong, HK;
Inventors:
Akio Nakao, Hong Kong, HK;
Masashi Shiraishi, Hong Kong, HK;
Assignee:
SAE Magnetics (H.K.) Ltd., Hong Kong, HK;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H04R 31/00 (2006.01); H04R 19/00 (2006.01); H04R 1/04 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/0061 (2013.01); B81C 1/00309 (2013.01); H04R 1/04 (2013.01); H04R 19/005 (2013.01); H04R 31/003 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81C 2203/019 (2013.01); B81C 2203/035 (2013.01); H04R 2201/003 (2013.01);
Abstract
A MEMS package has a MEMS chip, a package substrate, a dammed-seal part. The MEMS chip has an element substrate which a movable element is formed, the package substrate has a sound hole. The dammed-seal part has an annular dam-member which is formed on the element substrate so as to surround the movable element, and a gel member. The MEMS chip is mounted on the package substrate so that the movable element opposes to the sound hole. The gel member is formed by hardening of gel which is applied on the annular dam-member from outside so as to surround the annular dam-member.