The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Jun. 13, 2017
Applicant:

Dongbu Hitek Co., Ltd., Seoul, KR;

Inventors:

Dong Chun Park, Incheon, KR;

Han Choon Lee, Seoul, KR;

Assignee:

DB HITEK CO., LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/28 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/2807 (2013.01); B81B 3/0021 (2013.01); B81C 1/00015 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 31/006 (2013.01); B81B 2201/0257 (2013.01);
Abstract

A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate to cover the cavity and having a plurality of acoustic holes, a diaphragm disposed over the substrate to cover the cavity, the diaphragm being disposed under the back plate, including a venting hole communicating with the cavity, and sensing an acoustic pressure to create a displacement, and a first insulation layer interposed between the substrate and the diaphragm to support an end portion of the diaphragm to separate the diaphragm from the substrate, and the first insulation layer having an opening formed at a position corresponding to the cavity to expose the diaphragm. Thus, since the process of forming an anchor may be omitted, the process may be simplified, and process time may be shortened.


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