The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Nov. 28, 2018
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Ryuta Nishizawa, Nagano, JP;
Shiro Murakami, Shiojiri, JP;
Shinya Aoki, Minowa-Machi, JP;
Atsushi Matsuo, Shiojiri, JP;
Masashi Shimura, Chino, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03H 9/19 (2006.01); H01L 41/047 (2006.01); G01C 19/5621 (2012.01); H01L 23/00 (2006.01); H03B 5/32 (2006.01); H03H 9/10 (2006.01); G01C 19/5783 (2012.01); H03H 9/09 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0538 (2013.01); G01C 19/5621 (2013.01); G01C 19/5783 (2013.01); H01L 24/13 (2013.01); H01L 41/047 (2013.01); H03B 5/32 (2013.01); H03H 9/0519 (2013.01); H03H 9/0547 (2013.01); H03H 9/09 (2013.01); H03H 9/1021 (2013.01); H03H 9/19 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/13 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81207 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16195 (2013.01);
Abstract
A vibration device including a vibrator, a circuit component, a relay substrate disposed between the vibrator and the circuit component, a package that accommodates the vibrator, the circuit component, and the relay substrate, a first metal bump that joins the circuit component to the package, a second metal bump that joins the relay substrate to the circuit component, and a third metal bump that joins the vibrator to the relay substrate.