The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Aug. 24, 2018
Applicant:

Suncall Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Shojiro Wakabayashi, Kyoto, JP;

Masaya Nakagawa, Kyoto, JP;

Assignee:

Suncall Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 5/00 (2006.01); B05D 5/12 (2006.01); C25D 13/12 (2006.01); H01B 7/00 (2006.01); H01R 25/16 (2006.01); H01R 43/16 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H02G 5/005 (2013.01); B05D 5/12 (2013.01); C25D 13/12 (2013.01); H01B 7/00 (2013.01); H01R 25/16 (2013.01); H01R 43/16 (2013.01); H05K 1/056 (2013.01);
Abstract

A manufacturing method according to the present invention includes: a step of providing a first conductive metal flat plate; a step of forming a slit in a busbar assembly forming region of the flat plate; a step of coating the flat plate with a coating material containing an insulating resin such that at least the slit is filled with the insulating resin layer; a step of curing the coating material to form the insulating resin layer; and a cutting step of cutting off the insulating resin layer in the slit and busbar forming parts of the first conductive metal flat plate from the first conductive metal flat plate, wherein the busbar forming parts face each other with the slit therebetween.


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