The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Feb. 26, 2019
Applicant:

Finisar Corporation, Sunnyvale, CA (US);

Inventors:

Jia Lian, Shanghai, CN;

Huaping Peng, Shanghai, CN;

Shamei Shi, Shanghai, CN;

William H Wang, Pleasanton, CA (US);

Frank Flens, Campbell, CA (US);

Henricus Jozef Vergeest, Mountain View, CA (US);

Assignee:

II-VI Delaware Inc., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/70 (2011.01); H01R 12/71 (2011.01); H05K 3/34 (2006.01); H01L 23/492 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01R 12/7082 (2013.01); H01L 23/492 (2013.01); H01R 12/716 (2013.01); H05K 3/3436 (2013.01); H05K 1/181 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/2027 (2013.01);
Abstract

A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.


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