The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Nov. 25, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01Q 1/48 (2006.01); H01Q 21/06 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/66 (2013.01); H01Q 1/48 (2013.01); H01Q 21/065 (2013.01); H05K 1/0228 (2013.01); H05K 1/165 (2013.01); H01L 2223/6677 (2013.01); H05K 2201/10098 (2013.01);
Abstract
An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.